M606 High Cost-effective multifunction pick place machine Main Features: 1.The use of gigabit flight camera, which greatly improved the efficiency of placement 2.220V servo motor rated total power 1.5kv, the industry's lo
In-line X-ray and optical inspection for high-end electronics production. TRAILBLAZING X-RAY TECHNOLOGY AND ULTRA-MODERN XM CAMERA TECHNOLOGY IN ONE SYSTEM. The in-line X-ray system X7056-II is primarily distinguished by high throughput and first-c
Electronics Forum | Thu Apr 27 08:42:22 EDT 2017 | pvasquez
Hello M. We are a low volume high mix manufacturer with a total of 7 Mirtec AOI machines including a new MV-6 OMNI 3D system. I am very pleased with this machine! When we did our 3D AOI research, my team narrowed the field down to 2 vendors, Mirt
Electronics Forum | Wed Nov 15 16:14:02 EST 2000 | Scott Welle
We are having non-wet (head in pillow) problems with Altera 484's similar to the problems discussed on 10/27 timeframe. Need contacts to those people having similar problems. Will those who had problems with Motorola 357 (ref Chris and Glenn on 10/
Industry News | 2017-09-19 17:02:13.0
IPC — Association Connecting Electronics Industries® invites researchers, technical experts and industry leaders to submit abstracts for poster presentations at IPC APEX EXPO®, the industry’s premier conference and exhibition for printed board design and manufacturing, electronics assembly and test. Poster presentations are scheduled for Wednesday, February 28, 2018, and will be displayed throughout the event, offering additional visibility.
Industry News | 2018-02-12 10:15:49.0
IPC — Association Connecting Electronics Industries® invites researchers, technical experts and industry leaders to submit abstracts for poster presentations at IPC APEX EXPO®, the industry’s premier conference and exhibition for printed board design and manufacturing, electronics assembly and test. Poster presentations are scheduled for Wednesday, February 28, 2018, and will be displayed throughout the event, offering additional visibility.
Technical Library | 2013-12-27 10:39:21.0
The head-in-pillow defect has become a relatively common failure mode in the industry since the implementation of Pb-free technologies, generating much concern. A head-in-pillow defect is the incomplete wetting of the entire solder joint of a Ball-Grid Array (BGA), Chip-Scale Package (CSP), or even a Package-On-Package (PoP) and is characterized as a process anomaly, where the solder paste and BGA ball both reflow but do not coalesce. When looking at a cross-section, it actually looks like a head has pressed into a soft pillow. There are two main sources of head-in-pillow defects: poor wetting and PWB or package warpage. Poor wetting can result from a variety of sources, such as solder ball oxidation, an inappropriate thermal reflow profile or poor fluxing action. This paper addresses the three sources or contributing issues (supply, process & material) of the head-in-pillow defects. It will thoroughly review these three issues and how they relate to result in head-in pillow defects. In addition, a head-in-pillow elimination plan will be presented with real life examples will be to illustrate these head-in-pillow solutions.
Technical Library | 2023-09-05 21:00:53.0
The head on pillow defect is becoming more common. This paper describes one such occurrence for an OEM and explains how it was dealt with. In this particular case it was solved by application of problem solving skills by the OEM, component supplier and the solder paste provider
Welcome to this Defect of the Month video on head in and on pillow, this series of videos were produced for and featured as part of the NPL/IPC video library and examples are taken from the NPL Defect Database. Over the last couple of years there hav
Events Calendar | Mon Apr 23 00:00:00 EDT 2018 - Thu Apr 26 00:00:00 EDT 2018 | Shanghai, China
SMTA China East Conference 2018
SMTnet Express, May 26, 2016, Subscribers: 24,776, Companies: 14,803, Users: 40,361 Influence of Salt Residues on BGA Head on Pillow (Hip) J. Servin, P. Gomez, M. Dominguez, A. Aragon; Continental Corporation The oxide layers are known as wetting
SMTnet Express, December 27, 2013, Subscribers: 26441, Members: Companies: 13537, Users: 35564 Addressing the Challenge of Head-In-Pillow Defects in Electronics Assembly by Mario Scalzo; Indium Corporation While the electronics manufacturing
